Comprehensive Silicon Engineering Services for Next-Gen ASICs & SoCs
From RTL to Volume Production - complete turnkey and design services
Why MosChip?
First Indian Fabless Company – publicly listed
Proven track record of 200+ SoC Tapeouts
Expertise on 180nm to 2nm process nodes
Complex chip designs extending to 100Mn.+ gates
TSMC DCA Partner
Multiple OSAT partnerships
RTL to Volume Production
RTL Design
Verification
IP Integration & Verification
Synthesis, DFT & Physical Design
Fabrication, Package, Assembly & ATE Testing
Proto Shipment & Post-Silicon Validation
Qualification & Release to Production
Volume Production
Strategic Projects in Public Domain
Explore our engagements.
AUM – High Performance Computing SoC for C-DAC
Indigenous HPC Processor for India’s next-gen supercomputers; built on Arm Neoverse V2 platform with high-bandwidth I/O, designed with advanced packaging and on 5 nm technology node. MosChip is Lead India design partner with Socionext for SoC design & implementation.
VIDYUT Smart Energy Meter IC
Smart metering SoC program approved under MeitY’s Design Linked Incentive (DLI) scheme. It is a Polyphase Energy Measurement IC on a RISC-V based platform, complying with IS and IEC Standards. MosChip is designing and developing this Turnkey IC from architecture to silicon, targeting India and export markets.
Success Stories
MosChip has proven track record of delivering successful silicon designs to its customers. Explore some of our recent projects.
Turnkey ASIC for Edge AI Application
MosChip executed Turnkey ASIC program for EMASS (a subsidiary of Nanoveu Ltd.) on TSMC 22nm, delivering an Edge AI SoC for always-on intelligence, ultra-low-power applications across wearables, drones, industrial IoT, and sensor-rich devices. The engagement covered physical design, tape-out, packaging, assembly, evaluation hardware, and silicon validation.
Turnkey ASIC for Satellite Navigation Program
MosChip executed Turnkey ASIC program for ISRO’s Space Applications Centre (SAC) on TSMC 28nm, from netlist to fully packaged and validated silicon. The engagement involved DFT implementation & verification; Full-chip Physical Design and signoff; RDL design and routing; package design; tester board design; post-silicon bring-up and validation.
Need a Chip Design Partner?