Consumer Electronics Engineering for Connected Devices
From wearables to voice assistants, we engineer responsive, connected, and AI-powered consumer experiences - seamlessly integrated from device to cloud
The next era of consumer electronics is defined by intelligence, connectivity, and personalization. At MosChip, we build smart consumer applications that operate seamlessly across devices, cloud, and mobile ecosystems. Whether it’s wearables, voice assistants, or AR/VR systems, our full-stack engineering – from silicon to cloud to AI – helps brands bring faster, smarter, and more intuitive products to market.
Why MosChip?
25+ years of full-stack product engineering
End-to-end device-to-cloud engineering expertise
Strong partnership with leading FPGA companies
35M+ smart devices deployed globally
Strong AI/ML & GenAI personalization capabilities
75+ core AI Models and 30+ Edge AI model launched for product acceleration
30+ digital transformations programs delivered
What We Deliver?
Formfactor design, sensor/peripheral integration, COTS enclosures, low-power SoCs
Secure bootloaders, drivers, HALs, BSPs for ARM, RISC-V, and vendor SoCs |
OTA updates, telemetry, cloud pairing, AWS/Azure/GCP integration
Mobile/web app development, HMI, voice/gesture UX, real-time control apps
GenAI integration, custom inference models, edge intelligence for user behavior
Product Categories We Support
Featured Case Study
Face Analytics Solutions Using Azure ML Services
We bring expertise from silicon to software, enabling robust, cost-optimized, and power-efficient design—ready for mass production, OTA updates, and lifecycle management.
Absolutely. We integrate AI models for voice, vision, and gesture—and personalize user experiences using GenAI assistants and adaptive learning.
Yes. We enable seamless integration with popular ecosystems—Alexa, Google Home, CarPlay, AirPlay—and third-party APIs for faster market alignment.
Yes. We migrate firmware, re-architect systems for new platforms (Linux/Android), and upgrade hardware for better performance and longevity.
We optimize hardware-software co-design, sensor usage, and power states to achieve ultra-low power consumption—ideal for wearables and portable devices.
We engineer devices as part of a connected, multi-protocol ecosystem rather than standalone endpoints. Interoperability is enabled through native support for standards like Matter and Thread, along with unified communication stacks that abstract Wi-Fi, BLE, Zigbee, and Thread. This is further strengthened by our GenAIoT integrated IoT and connectivity suite, which provides a pre-built foundation for device connectivity and integration, ensuring seamless interaction, state coherence, and cross-platform compatibility across cloud and edge environments.
We engineer Edge AI around low-power AI models that are purpose-built for constrained devices, rather than adapting large models post-deployment. These models are optimized through quantization, reduced-precision inference, and hardware-aware execution across NPUs and DSPs, with runtime power management aligned to workload demand. This enables real-time, on-device intelligence within strict power and thermal limits, without compromising performance.
