25 years of revolution in silicon engineering and product engineering solutions from India to the world.
: In the rapidly evolving semiconductor industry, efficiency, precision, and reliability are paramount. OSAT solutions play a vital role in the semiconductor supply chain ensuring that silicon devices meet the quality and performance standards. Such solutions help deliver novel packaging and test solutions for semiconductor businesses across areas like consumer electronics, computers, automotive electronics, and wearable devices.
MosChip provides comprehensive OSAT solutions to address the needs within semiconductor industry, from simple to complex designs. With our partnership with global foundries, we offer seamlessly integrated design to production, delivering advanced packaging solutions including System-in-Package (SiP), wafer-level chip-scale packaging (WLCSP), assembly, and testing solutions.
Advanced packaging solutions ensuring the reliability and performance of your semiconductor devices, offering a variety of packaging types to suit client’s specific requirements.
Providing bumping to facilitate the connection between the chip and the package, enhancing electrical performance and thermal management.
Our assembly solutions guarantee precise and reliable integration of components, transforming delicate, processed silicon wafers into robust, functional semiconductor devices that can withstand the rigors of real-world applications
We offer comprehensive testing solutions to verify the functionality of semiconductor devices, ensuring they meet the highest quality standards.
MosChip provides efficient dropship solutions to deliver your fully tested and assembled semiconductor devices directly to your end customers, streamlining the supply chain and reducing lead time.
The Client is US based leading semiconductor company having expertise in…
The Client is US based leading semiconductor company having expertise in…
The Client is US based leading semiconductor company having expertise in…
