MosChip®

Wi-Fi Bluetooth Combo Connectivity Chip for Very Low Power IoT Applications

A case study ofSemiconductor Design Solutions

Leading US-based Tier-1 semiconductor company providing hardware and software solutions for diverse
industries such as consumer electronics, multimedia, automotive and networking sought to develop a Wi-Fi
Bluetooth combo chip tailored for low-power applications
MosChip provided ASIC design services for full chip physical design implementation and signoff

  •  MosChip with extensive experience and a proven track record of successfully handling multiple
  • designs across various technology nodes for cutting-edge applications

Wi-Fi Bluetooth Combo Connectivity Chip for Very Low Power IoT Applications

A case study of Semiconductor Design Solutions

Leading US-based Tier-1 semiconductor company providing hardware and software solutions for diverse
industries such as consumer electronics, multimedia, automotive and networking sought to develop a Wi-Fi
Bluetooth combo chip tailored for low-power applications.


MosChip provided ASIC design services for full chip physical design implementation and signoff.

  • MosChip with extensive experience and a proven track record of successfully handling multiple
  • designs across various technology nodes for cutting-edge application
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