Overview Of Product & Systems Engineering

Board Design Capabilities

  •  PCB Designs of upto 24 layers
  • 250+ System designs of varied complexity
  • High Density Interconnect (HDI) designs
  • Handling 0.8mm pitch BGAs
  • Design using Buried & Blind Vias
  • Impedance controlled and high speed designs
  • Signal Integrity, Power Integrity & Thermal Analysis
  • Dedicated resources for Schematic design, PCB design / Signal Integrity, Component assembly & Testing
  • Full support partnership eco-system in-place with PCB Manufacturing, components Assembly and equipment suppliers
  • Xilinx: Virtex-II Pro, Virtex-4/5/6, Virtex-7, Spartan, ARTIX, ZYNQ
  • Altera: Cyclone-II/III, Stratix-III/IV

Domain Expertise

  • EDA Tools :
    −Cadence OrCAD & Mentor Graphics for
    •Schematic Capture
    •PCB layout
    •Signal Integrity, Power Integrity & Thermal Analysis FPGA Families
    −Xilinx & Altera Series Interfaces
  • Hardcore Processor Interfaces
    −ARM9, Cortex A9 Cortile Modules Interconnect
  • Bus Interfaces
    −USB 2.0/3.0, PCIe, PCI, ISA, Gig. Ethernet RGMII, MII SATA, PATA, FireWire, RS232/422/485, IrDA, CAN, I2C, SPI, …
  • Audio/Video Interfaces
    −Codecs AC97, I2S, CSI, LVDS, Video ADC & DAC HDMI, LCD, DSI
  • Memory Interfaces
    −SDRAM, DDR/2/3, LPDDR
    −Flash (SPI & Parallel) CFD, SD Card, MMC …
  • Wireless WIFI 802.11 b/g/n, ZigBee, Bluetooth
  • Voltage Levels
    −LVPECL, LVDS, LVCMOS, LVTTL