Company YOUR ASIC REQUIREMENT Your Name * Email ID * Company Name 1. Product info : (Description of application of ASIC) 2. Product Volume and Target Price 3.Design Handoff Specification RTL Netlist GDSII Production 4.Requested Schedule City * 5. Process Node 250nm 130nm 90nm 65nm 40nm 28nm 20/20nm 16/14nm 12nm 7nm 6nm 5nm Others 6. Foundry TSMC Global Foundries Others 7. Special requirements Embedded Flash RDL Multi-VT: Single Multi-VT: Dual Multi-VT: Triple Multi-VT:Other 1T-SRAM / eDRAM Mixed Signal Layers: DNW Mixed Signal Layers: Ultra Thick Metal Mixed Signal Layers: Ploy R Efuse 8. Gate Count (including FFs) 9. Amount of embedded memory (Mb) 10. Expected Die Size (X, Y) 11. Fastest Core Clock (MHz) 12. Number of FFs 13. Internal SRAMs 14. IP Requirements 15. I/Os 16. Package 17. Test Requirements Mobile * Schedule (Call back) 18. Additional Requirements Would like to receive marketing info about MosChip Products & Services. Yes, Send me